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G. RADOSAVLJEVIC, A. MARIC, G. STOJANOVIC, L. J. ŽIVANOV, W. SMETANA, M.
UNGER, H. HOMOLKA
Application of The LTCC Technology for The
Fabrication of The RF 3D Inductor
Abstract. This paper introduces implementation of the LTCC technology in
fabrication of multilayer inductors. Easy fabrication of 3D structures offers a
comfortable way for the miniaturization of passive components, since their small
dimensions are required in RF applications. A novel design of multilayer
inductor is presented and its characteristics compared to the planar structure
with same geometrical parameters. It is shown that 3D structure displays better
behaviour in the frequency range of interest. Also, fabrication steps of the
LTCC technological process are presented on the example of the projected
inductor.
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