Romanian Journal of Information Science and Technology (ROMJIST)

An open – access publication

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ROMJIST is a publication of Romanian Academy,
Section for Information Science and Technology

Editor – in – Chief:
Radu-Emil Precup

Honorary Co-Editors-in-Chief:
Horia-Nicolai Teodorescu
Gheorghe Stefan

Secretariate (office):
Adriana Apostol
Adress for correspondence: romjist@nano-link.net (after 1st of January, 2019)

Founding Editor-in-Chief
(until 10th of February, 2021):
Dan Dascalu

Editing of the printed version: Mihaela Marian (Publishing House of the Romanian Academy, Bucharest)

Technical editor
of the on-line version:
Lucian Milea (University POLITEHNICA of Bucharest)

Sponsor:
• National Institute for R & D
in Microtechnologies
(IMT Bucharest), www.imt.ro

ROMJIST Volume 29, Number 3, 2026


CONTENTS:

Muhammad Ahsan SHAIKH, Sadiq Ur REHMAN, Halar MUSTAFA
Correlation-Aware Minimum Mean Square Error Channel Estimation for Uplink Massive Multiple-Input Multiple-Output Systems in Sixth-Generation Networks

pp. 213–224  |  DOI: 10.59277/ROMJIST.2026.3.01
Abstract | Read the full text

Sebastian-Alexandru DRAGUSIN, Denisa TOMA, Robert-Nicolae BOSTINARU, Nicu BIZON
A Multi-Stage Poisoning Detection Pipeline for Embedded Voice-Command Systems

pp. 225–236  |  DOI: 10.59277/ROMJIST.2026.3.02
Abstract | Read the full text

Palanichamy NAVEEN, Mahmoud HASSABALLAH
A Spectral-Attention Deep Learning-Based Approach to Deforestation Monitoring in Satellite Imagery

pp. 237–248  |  DOI: 10.59277/ROMJIST.2026.3.03
Abstract | Read the full text

Huawei HU, Yuxing XING, Jie WU, Jie CHEN, Radu-Emil PRECUP
Toward a Nash Equilibrium for Multi-agent Dynamic Task Assignment via Multi-stage Distributed Potential Game

pp. 249–260  |  DOI: 10.59277/ROMJIST.2026.3.04
Abstract | Read the full text

Hannah BLASIYUS, D. K. Sheena CHRISTY
Languages of Fuzzy Involutive Fibonacci Words

pp. 261–272  |  DOI: 10.59277/ROMJIST.2026.3.05
Abstract | Read the full text

Eunsung KIM, Heebo HA, Yuntae LEE, Dragan MARINKOVIC, Byungil HWANG
Reliability-Oriented Design of Low-Temperature Sn–Bi Solder Interconnects for Advanced Packaging Systems

pp. 273–283  |  DOI: 10.59277/ROMJIST.2026.3.06
Abstract | Read the full text






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